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b ism2? bluetooth version 2.0 serial module hardware integration guide version 2. 5 embedded wireless solutions support center: http://ews - support.lairdtech.com americas: +1 - 800 - 492 - 2320 europe: +44 - 1628 - 858 - 940 asia : +852 - 2923 - 0610 w ww.lairdtech.com/bluetooth
BISM2 bluetooth? hardware integration guide embedded wi reless solutions support center: http://ews - support.lairdtech.com www.lairdtech.com/ bluetooth 2 laird americas: +1 - 800 - 492 - 2320 europe : +44 - 1628 - 858 - 940 hong kong: +852 - 2268 - 6567 x026 r evision h istory revision date description approved by 1.0 initial release jonathan kaye 2.0 29 july 2103 converted to laird formatting sue white 2.1 31 oct 2013 updated maximum multipoint connections (from 7 to 3) jonathan k aye 2.2 16 jan 2014 separated manual into two documents: user guide and hardware integration guide sue white 2.3 06 feb 2014 updated bluetooth sig qualification section. updated doc section. jonathan kaye 2.4 27 feb 2014 added overall mechanical dimensi ons in physical dimensions . jonathan kaye 2.5 14 april 2014 updated bluetooth epl link jonathan kaye
BISM2 bluetooth? hardware integration guide embedded wi reless solutions support center: http://ews - support.lairdtech.com www.lairdtech.com/ bluetooth 3 laird americas: +1 - 800 - 492 - 2320 europe : +44 - 1628 - 858 - 940 hong kong: +852 - 2268 - 6567 x026 c ontents revision history ................................ ................................ ................................ ................................ ............ 1 contents ................................ ................................ ................................ ................................ ....................... 3 1 general description ................................ ................................ ................................ .............................. 4 2 specifications ................................ ................................ ................................ ................................ ......... 5 3 functional block diagram ................................ ................................ ................................ ..................... 6 4 i/o characteristics ................................ ................................ ................................ ................................ 11 5 dc characteristics ................................ ................................ ................................ ................................ 12 6 functional description ................................ ................................ ................................ ........................ 14 7 application information ................................ ................................ ................................ ..................... 17 8 board to board connector ................................ ................................ ................................ .................. 20 9 qualification ................................ ................................ ................................ ................................ ........ 21 10 bluetooth sig qualification ................................ ................................ ................................ ................ 24 11 environme ntal ................................ ................................ ................................ ................................ ..... 25 12 physical dimensions ................................ ................................ ................................ ............................ 26 13 related documents ................................ ................................ ................................ ............................. 30 14 differ ences from previous modules ................................ ................................ ................................ ... 30 15 disclaimers ................................ ................................ ................................ ................................ ........... 31
BISM2 bluetooth? hardware integration guide embedded wi reless solutions support center: http://ews - support.lairdtech.com www.lairdtech.com/ bluetooth 4 laird americas: +1 - 800 - 492 - 2320 europe : +44 - 1628 - 858 - 940 hong kong: +852 - 2268 - 6567 x026 1 g eneral d escription laird s BISM2 bluetooth serial module is a fully integrated and qualified class 1 b lueto oth solution designed for the lowest integration cost and ownership for designers wishing to incorporate bluetooth functionality into their products. the module is qualified to bluetooth version 2.0. the BISM2 bluetooth serial module is one of the most com pact complete bluetooth solutions, making it ideal to integrat e into handheld devices. another version of the BISM2 module is available that retains the same board size, mounting holes , and connector as the previous bluetooth module from laird , allowing us ers to access the improved radio performance and functionality without the need for any pcb modifications. the BISM2 module is based on cambridge silicon radios bluecore 04 chipset. the module contains all of the hardware and firmware for a complete bluet ooth solution, requir ing no further components. the m odule has an integrated, high performance antenna which is matched with the bluetooth rf and baseband circuitry. the firmware integrated into the bc04 chipset implements the higher layer bluetooth protoc ol stack, up to and including the generic access profile (gap), service discovery profile (sdap), serial port profile (spp), dial up networking (dun) p rofil e , headset profile (hsp), hands free profile (hfp), file transfer profile (ftp) and audio gatew ay. a virtual processor within the bc04 implement s an at command processor. this inter faces to the host system over a straight forward serial port using an extensive range of at command s. the at command set abstracts the bluetooth protocol from the host applica tion, saving many months of programming and integration time. it provides extremely short integration times for data - oriented cable replacement and voice applications. a low cost development system is available for fast product evaluation and development. an alternative version of firmware is available that provides multi - point prog ramming support . the m odule can be configured so that it can attach to a dumb terminal or attach to a pc or pda for cable replacement applications. in addition to the bluetooth functionality, the BISM2 module provide s access to 9 general i/o lines and 2 analogue input and output lines. these can be configured to provide connection to simple devices , such as switches or leds , without requiring any external pr ocessing. both the gp io and adc lines can be accessed either via the wired host uart connection, or remotely over the bluetooth link. the BISM2 module is supplied in a small form factor pcb (22.0 mm x 34.0 mm x 7.6 mm), that connects to a main pcb using a 40 - way hirose connect or. the interfa ce is compatible with the bism1 module. the module includes a high sensitivity, high gain antenna which provides excellent range. typical open field performance provides ranges of over 250 metres at transmit powers of 4 mw. support is provid ed for low power modes that make the BISM2 par ticularly applicable to battery powered installations. the BISM2 module is lead - free, rohs compliant , and supports an industrial temperature range of - 40c to +85 c. 1.1 applications ? pos equipment ? medical equipm ent ? telematics ? voice applications ? industrial automation ? automotive applications
BISM2 bluetooth? hardware integration guide embedded wi reless solutions support center: http://ews - support.lairdtech.com www.lairdtech.com/ bluetooth 5 laird americas: +1 - 800 - 492 - 2320 europe : +44 - 1628 - 858 - 940 hong kong: +852 - 2268 - 6567 x026 2 s pecifications 2.1 detailed specifications features implementation bluetooth transmission class 1 fully bluetooth pre - qualified bluetooth 2.0 range 250 metres typical (free spac e) frequency 2.4000 C 2.485 ghz max transmit power +6 dbm min transmit power - 27 dbm receive sensitivity better than - 86 db data transfer rate up to 300 kps serial interface rs232 bi - directional for commands and data using at commands serial paramet ers default 9600, n, 8, 1 C configurable from 1200 bps to 961200 bps support dtr, dsr, dcd, ri, rts, cts physical size 22.8 x 33.8 x 7.6 mm, 8 g 24.0 x 69.0 x 7.6 mm, 9 g (bism1 form factor) current consumption typically 22 ma during data transfer in standard power mode. lower powers are attainable with a configurable low power mode. low power sniff mode 2.5 ma typ temperature mode normal operation: - 40o c to +85o c supply voltage 3.6 v C 7.0 v brown - out integrated brown - out detection interface l evels 3.3 v logic audio audio can be transferred over sco channels through the pcm interface at 64 kbps. pcm can be configured as a master or slave. profiles ftp server, spp, dun, ftp, audio gateway, headset, handsfree multipoint max 3 slaves field upg radable over uart protocols at commands control and configure single point firmware. standard multipoint firmware uses a simple packet based protocol and requires a host to enable the module to function effectively. single point only allows a point - to - poi nt connection, whereas multipoint allows more than one simultaneous connection. gpio 9 x digital 2 x analogue (8 bit resolution) indicators 1 x programmable led (small form factor board only) lead free lead free and rohs compliant .
BISM2 bluetooth? hardware integration guide embedded wi reless solutions support center: http://ews - support.lairdtech.com www.lairdtech.com/ bluetooth 6 laird americas: +1 - 800 - 492 - 2320 europe : +44 - 1628 - 858 - 940 hong kong: +852 - 2268 - 6567 x026 3 f unctional b lock d iagram figure 3 - 1 : block diagram 3.1 connection diagram the module is equipped with a 40 - pin 0.5 mm pitch board - to - board connector that connects to the application platform. figure 3 - 2 : connection diagram
BISM2 bluetooth? hardware integration guide embedded wi reless solutions support center: http://ews - support.lairdtech.com www.lairdtech.com/ bluetooth 7 laird americas: +1 - 800 - 492 - 2320 europe : +44 - 1628 - 858 - 940 hong kong: +852 - 2268 - 6567 x026 3.2 pin descriptions the hirose df12c board - to - board connector on the module is a 40 - pin double - row receptacle. the table below defines the pin functions. note that this pin - out is as viewed from the underside of th e m odule. pin no. signal description pin no. signal description 1 analogue 0 1.8 v max 2 gpio1 i/o for host 3 analogue 1 1.8 v max 4 gpio2 i/o for host 5 spi_miso spi bus serial o/p 6 uart_ri ring input or output
BISM2 bluetooth? hardware integration guide embedded wi reless solutions support center: http://ews - support.lairdtech.com www.lairdtech.com/ bluetooth 8 laird americas: +1 - 800 - 492 - 2320 europe : +44 - 1628 - 858 - 940 hong kong: +852 - 2268 - 6567 x026 pin 8 (uart_dcd) is active low. it is normally 3.3v. when a connection is live this pin is low. this means that when this pin is converted to rs232 voltage levels it will have the correct voltage level for assertion. pin 10 (uart_dsr) is an input, with active low logic. it should be connected to the dtr output of the host. when the BISM2 module is in high speed mod e (see definition for s register 507), this pin should be asserted by the host to ensure that the connection is maintained. a deassertion is taken to mean that the connection should be dropped, or an online command mode is being requested. pin 27 (vcc_3v3 monitor) may only be used for monitoring purposes. it must not be used as a current source. the gpio pins can be accessed using s registers 621 to 628. gpio4 is connected to an led on the module. if these i/o pins are set for input, then the led will be dr iven by the host and appropriate drive current requirements must be satisfied. a logic 1 switches on the led. gpio3 is also used for dtr output (active low). see s register 552 & 553. analogue 0 and 1 should not exceed 1.8v and s registers 701 and 702 are used to access them. 3.3 electrical specifications 3.3.1 absolute maximum ratings absolute maximum ratings for supply voltage and voltages on digital and analogue pins of the module are listed below. warning: e xceeding these va lues causes permanent damage to the mod ule . parameter min max unit peak current of power supply 0 100 ma voltage at digital pins - 0.3 3.7 v voltage at power pin 3.6 7 v 3.3.2 recommended operating parameters 3.3.2.1 power supply signal name pin no. i/o voltage level comments vcc 29 i 3.6 v to 7.0 v i ty p C 30 ma gnd 11, 15, 18, 30, 36, 38 6 ground terminals to be attached in parallel vcc_3v3 27 o 3.3 v typical for monitoring only. no current source. 3.3.2.2 rs232 interface signal name pin no. i/o voltage level comments uart_tx 21 o v ol max = 0.2 v v oh min = 2.8 v i typ C 30 ma uart_rx 25 i v il max = 0.8 v 6 ground terminals to be attached in parallel
BISM2 bluetooth? hardware integration guide embedded wi reless solutions support center: http://ews - support.lairdtech.com www.lairdtech.com/ bluetooth 9 laird americas: +1 - 800 - 492 - 2320 europe : +44 - 1628 - 858 - 940 hong kong: +852 - 2268 - 6567 x026 signal name pin no. i/o voltage level comments v ih max = 2.1 v v ih max = 3.7 v uart_cts 19 o v il max C ih min = 2.1 v v ih max = 3.7 v uart_rts 23 o v ol max = 0.2 v v oh min = 2.8 v uart_dsr 10 i v il max = 0.2 v v ih min = 2.8 v v ih max = 3.7 v uart_dtr 12 o v ol max = 0.2 v v oh min = 2.8 v shared with gpio3 uart_ri 6 i or o o/p:v ol max = 0.2 v v oh min = 2.8 v i/p: v il max = 0.8 v v ih min = 2.1 v v ih max = 3.7 v direction may be programmed uart_dc d 8 i or o o/p:v ol max = 0.2 v v oh min = 2.8 v i/p: v il max = 0.8 v v ih min = 0.8 v v ih max C 3.3.2.3 spi bus signal name pin no. i/o voltage level comments spi_mosi 17 i v il max = 0.8 v v ih min = 2.1 v v ih max = 3.7 v u sed to reprogram flash spi_miso 5 o v ol max = 0.2 v v oh min = 2.8 v spi_csb 7 i v il max = 0.8 v v ih min = 2.1 v v ih max = 3.7 v spi_clk 9 i v il max = 0.8 v v ih min = 2.1 v v ih max = 3.7 v
BISM2 bluetooth? hardware integration guide embedded wi reless solutions support center: http://ews - support.lairdtech.com www.lairdtech.com/ bluetooth 10 laird americas: +1 - 800 - 492 - 2320 europe : +44 - 1628 - 858 - 940 hong kong: +852 - 2268 - 6567 x026 3.3.2.4 pcm interface signal name pin no. i/o voltage level comments pcm_ clk 20 i or o o/p: v ol max = 0.2 v v oh min = 2.8 v i/p: v il max = 0.8 v v ih min = 2.1 v v ih max = 3.7 v if unused, keep lines open. pcm_in 22 i v il max = 0.8 v v ih min = 2.1 v v ih max = 2.7 v pcm_sync 24 i or o o/p: v ol max = 0.2 v v oh min = 2.8 v i/p: v il max = 0.8 v v ih min = 2.1 v v ih max = 3.7 v pcm_out 26 o v ol max = 0.2 v v oh min = 2.8 v 3.3.2.5 general purpose i/o and adc signal name pin no. i/o voltage level comments gpio 1 C 9 2, 4, 12, 14, 16, 33, 35, 37, 39 i or o o/p: v o l max = 0.2 v v oh min = 2.8 v i/p: v il max = 0.8 v v ih min = 2.1 v v ih max = 3.7 v aio_0, aio_1 1, 3 i range 0 C 1.8 v 3.3.2.6 miscellaneous signal name pin no. i/o voltage level comments reserved usb d - i v il max = 0.3 vdd_usb v ih min = 0.7 vdd _usb normally inactive. pull to gnd through 10k. reserved usb d+ i vilmax = 0.3 vdd_usb vihmin = 0.7 vdd_usb normally inactive. pull to gnd through 10k. reset reset i threshold 2.6 v active high. terminology: usb signal levels. vdd_usb refers to the in ternal voltage generated by the ldo regulator on the module, which is typically 3.3 v. hence 0.3 vdd_usb and 0.7 vdd_usb correspond to 1.0 v to 2.3 v. if vcc falls below the recommended 3.6 v minimum , these values are reduced.
BISM2 bluetooth? hardware integration guide embedded wi reless solutions support center: http://ews - support.lairdtech.com www.lairdtech.com/ bluetooth 11 laird americas: +1 - 800 - 492 - 2320 europe : +44 - 1628 - 858 - 940 hong kong: +852 - 2268 - 6567 x026 4 i/o c haracteristics 4.1 power c onsumption the current drain from the vcc power input line is dependent on various factors. the three most significant factors are the voltage level at vcc, uart b audrate , and the operating mode. the modules hardware specification allows for a voltage ran ge of 3.6 to 7.0 at vcc. tests have shown that there is no significant difference in current draw when vcc is 5 or 6 v. therefore the data presented below pert ains to vcc levels of 3.6 and 5 v only. tests have shown that where power drain is an issue, it i s best to keep vcc at the lower end of the range. the uart baudrate has a bearing on power drain because as is normal for digital electronics, the power requirements increase linearly with increasing clocking frequencies. hence higher baudrates result in a higher current drain. w ith regards to operating mode , the significant modes are: idle , waiting for a connection , inquiring , i nitiat ing a connection , sniff , and connected . with connected mode, it is also relevant to differentiate between no transferring da ta and when data is transfers at the maximum rate possible. the at command s et document describes how to configure the m odule for optimal power performance. baud 9,600 38,400 115,200 460,800 idle mode, s512 = 1 3.6 v 1.60 1.80 1.96 3.00 5.0 v 2.00 2.10 2.30 3.40 wait for connection or discoverable mode, at+btp s508 = s510= 640, s409= s511 = 11* 3.6 v 59.00 59.00 59.00 59.00 5.0 v 65.00 65.00 65.00 65.00 wait for connection or discoverable mode, at+btp s508=s510=1000, s509 = s511 = 11* 3.6 v 2.75 2.94 3.10 4.12 5.0 v 3.26 3.36 3.55 4.63 inquiring mode, at+bti 3.6 v 50.00 50.00 50.00 50.00 5.0 v 54.00 54.00 54.00 54.00 connecting mode (atdxxx) 3.6 v 50.00 50.00 50.00 50.00 5.0 v 54.00 54.00 54.00 54.00 connected mode (no data transfer) 3.6 v 6.00 6.10 6.40 7.20 5.0 v 7.20 7.20 7.40 8.20 connected mode (max data transfer) 3.6 v 21.50 22.50 24.50 32.50 5.0 v 24.50 26.00 28.00 36.00 * calculated figures note: these figures were obtained with pre - production firmware. production values are typically 20% lower.
BISM2 bluetooth? hardware integration guide embedded wi reless solutions support center: http://ews - support.lairdtech.com www.lairdtech.com/ bluetooth 12 laird americas: +1 - 800 - 492 - 2320 europe : +44 - 1628 - 858 - 940 hong kong: +852 - 2268 - 6567 x026 5 dc c haracteristics 5.1 rf performance 5.1.1 transmit power conducted transmit power min: 1.0 mw (0dbm) max: 4 mw (6 dbm) antenna gain +2 dbi typ. effective transmit power min: 0 dbm max: +6 dbm reduce output power by program control. 5.1.2 receiv e sensitivity receive sensitivity - 86 dbm (at 25o c) antenna gain +2 dbi typ. effective transmit power - 88 dbm (at 25o c) 5.1.3 rf performance data
BISM2 bluetooth? hardware integration guide embedded wi reless solutions support center: http://ews - support.lairdtech.com www.lairdtech.com/ bluetooth 13 laird americas: +1 - 800 - 492 - 2320 europe : +44 - 1628 - 858 - 940 hong kong: +852 - 2268 - 6567 x026 5.2 range see the data transfer r ate vs. distance graph bel ow. the data throughput of the m odule is limited to 28 0 kbps by the parsing of the data transferring through the rfcomm stack. the graph below shows the typical data throughput. distances are me asured in free space between two m odules. 5.3 temperature performance
BISM2 bluetooth? hardware integration guide embedded wi reless solutions support center: http://ews - support.lairdtech.com www.lairdtech.com/ bluetooth 14 laird americas: +1 - 800 - 492 - 2320 europe : +44 - 1628 - 858 - 940 hong kong: +852 - 2268 - 6567 x026 6 f unctional d escription the BISM2 bluetooth mod ule is a self - contained bluetooth product and requires only power to implement full bluetooth communication. the integrated, high performance an tenna together with the rf and b ase - band circuitry provides the bluetooth wireless link . t he uart interface prov ides a connection to the host system. the variety of interfaces and the at command set allow the BISM2 module to be used for a wide number of short range wireless applications, from simple cable replacement to complex multipoint applications where multiple radio links are active at the same time. the complexity and flexibility of configuration are made simple for the design engineer by the integration of a n extremely c omprehensive set of at commands, supplemented with a range of s registers which are used for non - volatile storage of system parameters. these are fully documented in the blu2i at command reference manual. to provide the widest scope for integration , laird provides a range of dif ferent physical host interfaces. 6.1 interfaces 6.1.1 uart interface uart _tx, uart_rx, uart_rts , and uart_cts form a conventional asynchronous serial data port with handshaking. the interface is designed to operate correctly when connected to other uart devices such as the 16550a. the signalling levels are nominal 0 v and 3.3 v and are inverted with respect to the signalling on an rs232 cable. the interface is programmable over a variety o f bit rates: no, even or odd parity, s top bit , and hardware flow control. the default condition on power - up is pre - assigned in the external fl ash. two - way hardware flow control is implemented by uart_rts and uart_cts. uart_rts is an output and is active low. uart_cts is an input and is active low. these signals operate according to normal industry convention. by writing different values to the r elevant s register , the uart_ri can be continuously polled to detect incoming communication. the uart_ri signal serves to indicate incoming calls. uart_dsr is an active low input. it should be connected to dtr output of the host. when the module is running in high speed mode (s ee definition for s reg 507), this pin should be asserted by t he host to ensure connection maintains . a de - assertion mean s that the connection should be dropped, or an online command mode is being requested. the module communicates wi th the customer application using the following signals: ? rs - 232 ? port /txd @ application sends data to the modules uart_rx signal line ? port /rxd @ application receives data from the modules uart_tx signal line figure 6 - 1 : uart interfaces note: t he serial module output is at 3.3v cmos logic levels. level conversion must be added to interface with an rs - 23 2 level compliant interface.
BISM2 bluetooth? hardware integration guide embedded wi reless solutions support center: http://ews - support.lairdtech.com www.lairdtech.com/ bluetooth 15 laird americas: +1 - 800 - 492 - 2320 europe : +44 - 1628 - 858 - 940 hong kong: +852 - 2268 - 6567 x026 6.1.2 spi bus the m odule is a slave device that uses terminals spi_mosi, spi_mis o, spi_clk and spi_csb. this interface program s firmware updates at the factory. laird supplies a pc based utility to allow firmware upgrade over the uart port. it is highly recommended that customers use this method for updating firmware. note: the design er should be aware that no security protection is built into the hardware or firmware associated with this port, so the terminals should not be permanently connected in a pc application. 6.1.3 gpio port eight lines of programmable bi - directional input/outputs (i /o) are provided that can be accessed either via the uart port, or over the air (ota) from a second bluetooth unit. these can be used as data inputs or to control external equipment. by using these in ota mode, a bism module can control and data acquisitio n without the need for any additional host processor. each of the gpio [1:8] ports can be independently configured to be either an input or output. a selection of ports can be accessed synchronously. gpio 1 and 2 can be configured as event counters. the p orts are powered from vcc . the mode of these lines can be configured and you can access the lines via s registers 621 to 628. low latency i/o can be accessed by using laird s i/o via an enhanced inquiry process. 6.1.4 pcm codec interface pcm_out, pcm_in, pcm_clk and pcm_sync carry up to three bi - directional channels of voice data, each at 8 k samples/s. the format of the pcm samples can be 8 - bit a - law, 8 - bit - law, 13 - bit linear , or 16 - bit linear. the pcm_clk and pcm_sync terminals can be configured as inputs or outputs, depending on whether the module is the master or slave of the pcm interfac e. please contact a laird fae for further details. the m odule is compatible with the motorola ssi tm interface and interfaces directly to pcm audio devices including the following: compatible codec chips ? winbond w61360 13 - bit linear codec (motorola mc14548 3 compatible) ? oki msm7702 single channel a - law and - law codec ? oki msm7705 four channel a - law and - law codec the default codec support is for the winbond w61360 note : codec development boards that mate with the laird wireless developers kit are available for each of th e three codecs listed above.
BISM2 bluetooth? hardware integration guide embedded wi reless solutions support center: http://ews - support.lairdtech.com www.lairdtech.com/ bluetooth 16 laird americas: +1 - 800 - 492 - 2320 europe : +44 - 1628 - 858 - 940 hong kong: +852 - 2268 - 6567 x026 6.1.5 adc the BISM2 provides access to two 8 - bit adcs. these provide an input range of 0 mv to 1,800 mv, which can be read using the s registers 701 and 702. suitable external scaling and over - voltage protection should be incorporate d in your design. the module provides 5 samples per second at the uart with a baud rate of 115200 or above. low latency access of the upper 6 bits of the adcs can be obtained by using laird s i/o via an enhanced inquiry process. 6.1.6 led a single led provides i nformation on the status of the module. it is controlled by a n s register to display the status of various parameters and is useful for debug and test.
BISM2 bluetooth? hardware integration guide embedded wi reless solutions support center: http://ews - support.lairdtech.com www.lairdtech.com/ bluetooth 17 laird americas: +1 - 800 - 492 - 2320 europe : +44 - 1628 - 858 - 940 hong kong: +852 - 2268 - 6567 x026 7 a pplication i nformation 7.1 antenna position the antenna used on the BISM2 bluetooth module is designed to be largely immune from the effects of proximity detuning. normally, antennas operating at 2.4ghz are affected by their surroundings, so that great care is needed in their placement and orientation. the BISM2 can be used in most locations and orientations and is only marginally affected by the presence of a significant ground plane in close proximity. the antenna distribution is close to isotropic, which means that the orientation of mounting has only a limited effect on the overall range. however the optim um range is achieved when the two antennae are directly facing each other. example of radiation characteristics: horizontal polarisation vertical polarisation typical radiation characteristics. measured at 2.5metres from a sta ndard dipole.
BISM2 bluetooth? hardware integration guide embedded wi reless solutions support center: http://ews - support.lairdtech.com www.lairdtech.com/ bluetooth 18 laird americas: +1 - 800 - 492 - 2320 europe : +44 - 1628 - 858 - 940 hong kong: +852 - 2268 - 6567 x026 the module should not be located in a sealed metal enclosure, as this will act as a faraday cage and severely attenuate the radio signal. the antenna finish may tarnish as a result of environmental effects and handling. this is a cosmetic eff ect and does not affect the rf performance. 7.2 power supply considerations the power supply for the module has to be a single voltage source of vcc within the range of 3.6 v to 7.0 v. it must be able to provide sufficient current in a transmit burst. this can rise to 65ma. the module includes regulators to provide local 3.3v. this rail is accessible on connector j2 for monitoring purposes only. under no circumstances should this pin be used to source current. power (vcc) can be provided via the board - to - board connector pin 29 on j2. 7.3 power - on - reset (power cycling and brown out considerations) the module is provided with an active high reset pin (hirose 40way df12c connector pin 13). upon the application of power, the power on reset circuit built into the module will ensure that the unit starts correctly. there is no need for an external power reset monitor. note: the previous version of the bluetooth serial module required a n external brown out circuit to ensure correct operation. this circuitry has now been inco rpor ated into the module. the power supply has been designed to work with previous versions of custome r circuitry that may or may not have external brown - out implementations. customers migrating f rom a bism1 to BISM2 module may be able to simplify their po we r supply circuitry as a result. 7.4 rf shield to meet fcc requirements, all modules are supplied with a soldered rf shield. this meets the requirement that users may not be able to access rf circuitry without special tools. removal of the shield may negate r f approvals. 7.5 mounting the module onto the application platform there are many ways to properly install the module in the host device. an efficient approach is to mount the pcb to a frame, plate, rack or chassis. fasteners can be m1.8 or m2 screws plus suit able washers, circuit board spacers, or customized screws, clamps, or brackets in 2.2mm diameter holes. note that care should be taken to ensure the head of the fixing does not interfere with the circuit. nylon fixings are recommended. in addition, the boa rd - to - board connection can also be utilized to achieve better support. the antenna (brown square component on top side of pcb) must not be influenced by any other pcbs, components or by the housing of the host device. the proximity of the antenna to large metallic objects can affect the range and performance of the system. designers should carefully consider the location of the module and the type of enclosure material that is used. to prevent mechanical damage, be careful not to force, bend or twist the mo dule . be sure it is positioned flat against the host device.
BISM2 bluetooth? hardware integration guide embedded wi reless solutions support center: http://ews - support.lairdtech.com www.lairdtech.com/ bluetooth 19 laird americas: +1 - 800 - 492 - 2320 europe : +44 - 1628 - 858 - 940 hong kong: +852 - 2268 - 6567 x026 7.5.1 fixing pillars laird in conjunction with richco has designed a mounting pillar for use with the bluetooth serial module . this allows the module to be securely held to a primary pcb using snap fit details. a variety of different heights are available to accommodate different variants of hirose stacked connectors. pillars supporting a 3.5mm stacked board height can be supplied by laird . these and alternative spacings can also be ordered directly fro m richco. customer designs using these pillars should use 2.5mm diameter holes on a 1.6mm thick pcb. in conjunction with the 3.6 mm stacked height hirose if they are to take advantage of this. board spacing part number source matching hrs pcb socket 3. 6 mm npr2005 - 153 - 3.6 laird / richco cl537 - 0032 - 4 - 86 4.1 mm npr2005 - 153 - 4.1 richco cl537 - 0057 - 5 - 86 5.1 mm npr2005 - 153 - 5.1 richco cl537 - 0157 - 0 - 86
BISM2 bluetooth? hardware integration guide embedded wi reless solutions support center: http://ews - support.lairdtech.com www.lairdtech.com/ bluetooth 20 laird americas: +1 - 800 - 492 - 2320 europe : +44 - 1628 - 858 - 940 hong kong: +852 - 2268 - 6567 x026 8 b oard to b oard c onnector this chapter provides specifications for the 40 - pin board - to - board connector whic h serves as physical interface to the host application. the receptacle assembled on the module is hirose type df12c. 8.1 stacking height mating headers from hirose are available in different stacking heights, allowing the spacing between the BISM2 and carrier pcb to be changed from 3.5mm to 5.0mm. item part number stacking height hrs number receptacle on module df12c - 40ds - 0.5v(86) 3.5 mm C 8.2 hirose connector general specification parameter specification (40 pin board to board connector) number of contacts 40 quantity delivered 2000 connectors per tape & reel voltage 50 v current rating 0.5 a max per contact resistance 0.05 ohm per contact dielectric withstanding voltage 500 v rms min operating temperature - 45o c to +125o contact material phosphor bronze (surface: gold plated) insulator material pa, beige natural stacking height 3.0 mm; 3.5 mm; 4.0 mm; 5.0 mm
BISM2 bluetooth? hardware integration guide embedded wi reless solutions support center: http://ews - support.lairdtech.com www.lairdtech.com/ bluetooth 21 laird americas: +1 - 800 - 492 - 2320 europe : +44 - 1628 - 858 - 940 hong kong: +852 - 2268 - 6567 x026 parameter specification (40 pin board to board connector) insertion force 21.8 n withdrawal force 1 st 10 n withdrawal force 50 th 10 n maximum connection cycles 50 9 q u alification 9.1 bluetooth qualification process the following safety precautions must be observed during all phases of the operation, usage, service , or repair of any application incorporating this m odule. manufacturers of the rf equipment are advised to conve y the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. failure to comply with these precautions violates safety standards of design, manufacture , and intended use of the product. laird assumes no liability for customer failure to comply with these precautions. 9.2 safety information switch off the bluetooth device before boarding an aircraft. make sure it cannot be switched on inadvertently. to prevent interference with communications systems, t he operation of wireless appliances in an aircraft is forbidden by many a irlines. applications that could result in use on aircraft should carry appropriate warnings. 9.3 qualifications 9.3.1 rf approvals the m odule is listed as a bluetooth product in terms of the bluetooth sig program reference document (prd). this means that it can be integrated into end products without further testing or approval listing. the manufacturer must state the laird part number and product reference in his lite rature in order to meet the requirements of the bluetooth and regulatory approvals. laird provides a l ist of the countries where the module is approved as required. as a minimum , the product is listed in europe, scandinavia , and usa. laird assumes no liabi lity for customer failure to comply with national rf approvals. 9.3.1.1 emc emissions en 300 328 v1.5.1 (2004 - 08) 9.3.1.2 emc immunity en 301 489 - 1 v1.4.1 (2002 - 08) 9.3.1.3 fcc fcc part 15.247:2004 (subpart c) fcc id: pi401b
BISM2 bluetooth? hardware integration guide embedded wi reless solutions support center: http://ews - support.lairdtech.com www.lairdtech.com/ bluetooth 22 laird americas: +1 - 800 - 492 - 2320 europe : +44 - 1628 - 858 - 940 hong kong: +852 - 2268 - 6567 x026 9.4 safety and regulatory statements 9.4.1 europe C eu declaratio n of conformity manufacturer laird technologies product trblu23 - 00200 / trblu23 - 00300 eu directive rtte 1999 /5/ec conformity assessment annex iv reference standards used for presumption of conformity: article number requirement reference standard(s): 3.1a health and safety iec 60950 - 1:2005 (2 nd ed); am 1:2009 en 60950 - 1:2006+a11:2009 a+a1:2010+a12:2011 3.1a rf exposure en 62479:2010 3.1b protection requirements with respect to electromagnetic compatibility en 301 489 - 1 v1.9.2 (2011 - 09) en 301 489 - 1 7 v2.2.1 (2012 - 09) emissions: en55022:2010 /a1:2011, class b immunity: en61000 - 4 - 2:2009 en61000 - 4 - 3:2006 /a1:2008/a2:2010 3.2 means of the efficient use of the radio frequency spectrum en 300 328 v1.8 .1 (2012 - 06) declaration: we, laird , declare under o ur sole responsibility that the essential radio test suites have been carried out and that the above product to which this declaration relates is in conformity with all the applicable essential requirements of ar ticle 3 of the eu directive 1999 /5/ec, when used for its intended purpose. place of issue: laird technologies saturn house, mercury park wooburn green hp100hh, united kingdom tel: +44 (0)1628 858 940 fax: +44 (0)1628 528 382 date of issue: february 2014 name of authorised person: andrew dobbing, engineering manager signature:
BISM2 bluetooth? hardware integration guide embedded wi reless solutions support center: http://ews - support.lairdtech.com www.lairdtech.com/ bluetooth 23 laird americas: +1 - 800 - 492 - 2320 europe : +44 - 1628 - 858 - 940 hong kong: +852 - 2268 - 6567 x026 9.4.2 fcc and industry canada statements this device complies with part 15 of the fcc rules. operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. 9.4.2.1 fcc labelling requirement if the fcc id is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. this exterior label can use wording such as the following: contains transmitter module fcc id: pi401b or contains fcc id: pi401b. any similar wording that expresses the same meaning may be used.
BISM2 bluetooth? hardware integration guide embedded wi reless solutions support center: http://ews - support.lairdtech.com www.lairdtech.com/ bluetooth 24 laird americas: +1 - 800 - 492 - 2320 europe : +44 - 1628 - 858 - 940 hong kong: +852 - 2268 - 6567 x026 10 b luetooth sig q ualification the BISM2 module is listed on the bluetooth sig websit e as qualified end products. design name owner declaration id link to listing on the sig website BISM2 laird technologies b0245600 https://www.bluetooth.org/tpg/qli_viewqdl.cfm?qid=106 50 it is a mandatory requirement of the bluetooth special interest group (sig) that every product implementing bluetooth technology has a declaration id. every bluetooth design is required to go through the qualification process, even when referencing a bluetooth design that already has its own declaration id. the qualification process requires each company to registered as a member of the bluetooth sig C www.bluetooth.org the following link provides a link to t he bluetooth registration page: https://www.bluetooth.org/login/register/ for each bluetooth design it is necessary to purchase a declaration id. this can be done before starting the new qualifica tion, either through inv oicing or credit card payment. the fees for the declaration id will depend on your membership status, please refer to the following webpage: https://www.bluetooth.org/en - us/test - qualification/qualification - overview/fees for a detailed procedure of how to obtain a new declaration id for your design, please refer to the following sig document: https://www.bluetooth.org/docman/handlers/downloaddoc.ashx?doc_id=283698&vid=317486 to start the listing, go to: https://www.bluetooth.org/tpg/qli _sdoc.cfm . in step 1, select reference a q ualified design and enter 245600 i n the end product table entry. you can then select your pre - paid declaration id from the drop down menu or go to the purchase declaration id page, (please note that unless the de claration id is pre - paid or purchased with a credit card, it will not be possible to proceed until the sig invoice is paid. once all the relevant sections of step 1 are finished , complete steps 2, 3 , and 4 as d escribed in the help document. your new design will be listed on the sig website and you can print your certificate and doc. for further information please refer to t he following training material: https://www.bluetooth.org/en - us/test - qualification/qualification - overview/listing - process - updates 10.1 additional assistance please contact your local sales representative or our support team for further assistance: laird technologies connectivity pr oducts business unit support centre: http://ews - support.lairdtech.com email: wireless.support@lairdtech.com phone: americas: +1 - 800 - 492 - 2320 option 2 europe: +44 - 1628 - 858 - 940 hong kong: +852 2923 0610 web: http://www.lairdtech.com/bluetooth
BISM2 bluetooth? hardware integration guide embedded wi reless solutions support center: http://ews - support.lairdtech.com www.lairdtech.com/ bluetooth 25 laird americas: +1 - 800 - 492 - 2320 europe : +44 - 1628 - 858 - 940 hong kong: +852 - 2268 - 6567 x026 11 e nvironmental 11.1 operating temperatures parameter min typ max unit operating temp (standard product) - 40 25 +85 oc 11.2 storage temperatures parameter min max unit storage temp - 40 +125 oc 11.3 reliability parameter test comment thermal shock 200 cycles - 40o c / +85o c 30 min 1 cycle/hour vibration continuous operation at 60 hz, 2 mm stroke 15 g max sine wave, 12 hou rs shock 50 g 11 ms half sine wave 6 axis x 3 cycles each axis moisture resistance high temp storage 85o c, 360 hours low temp storage - 40o c, 240 hours high temp/ humidity operation 60o c, 90% rh, 360 hours thermal shock - 40 to +60o c in 30 min 200 cycles with continuous operation electrostatic discharge en55024:1998 & iec61000 - 4 - 3 drop test 75 cm to concrete, 3 axis x 2 cycles per corner
BISM2 bluetooth? hardware integration guide embedded wi reless solutions support center: http://ews - support.lairdtech.com www.lairdtech.com/ bluetooth 26 laird americas: +1 - 800 - 492 - 2320 europe : +44 - 1628 - 858 - 940 hong kong: +852 - 2268 - 6567 x026 12 p hysical d imensions 12.1 mechanical dimensions 12.1.1 standard module all dimensions in mm. table 1 : overall dimensions physical dimensions 22.8 x 33.8 z 7.6mm, 8g 24.0 x 69.0 x 7.6mm, 9g (bism1 form factor)
BISM2 bluetooth? hardware integration guide embedded wi reless solutions support center: http://ews - support.lairdtech.com www.lairdtech.com/ bluetooth 27 laird americas: +1 - 800 - 492 - 2320 europe : +44 - 1628 - 858 - 940 hong kong: +852 - 2268 - 6567 x026 location of connector (bottom view): 12.2 BISM2 module without antenna (special order) the dimensions for this module are identical to the standard BISM2 illustrated above, but a u.fl connector replaces the antenna. top view: the external antenna used must not result in an increased output power, i .e. the total gain of mating connector, cable , and antenna must not exceed +2 db. if a higher gain antenna is connected, it will invalidate the rf and bluetooth approvals for the module. the external antenna must provide 50 ohm impedance. the antenna connector is a u.fl connector, supplied by hirose. mating connectors with cables are availab le from hirose and their distributors, and also from other cable suppliers. the data sheet for the connector series is available at http://www.hirose.co.jp/cataloge_hp/e32119372.pdf .
BISM2 bluetooth? hardware integration guide embedded wi reless solutions support center: http://ews - support.lairdtech.com www.lairdtech.com/ bluetooth 28 laird americas: +1 - 800 - 492 - 2320 europe : +44 - 1628 - 858 - 940 hong kong: +852 - 2268 - 6567 x026 12.2.1 externa l antennae a variety of manufacturers can supply external antennae suitable for use with the BISM2 module without antenna. users should be aware that the choice of antenna may affect the qualification of the module. to ensure that the qualification is not affected, the total gain of the external antenna, including insertion loss of the connectors and cable , must be less than 2 dbi. if employing a higher gain , then the pre - qualified status of the module will be lost. it is the customers responsibility to e nsure that an external antenna does not negate the qualification. centurion ( www.centurion.com ) manufacture s a snap - in external connector of the form generally known as a rubber duck with a 100 mm captive lead ter minated in a u.fl connector that is particularly appropriate for use with the BISM2 module. the part number is wcr 2400 - ip . novaets ( www.novaets.com ) in the uk supplies a rubber duc k antenna with u.fl connection. th e ordering inf ormation is w - 154c 2db wireless lan antenna (2. 4 ghz) assembled with u.fl (ipx) connector. reel C rienheimer elektronic ( www.reel - gmbh.de ) manufacture s a wide range of antennae, including their plantec roof antennae , that are ideal for vehicle mounting. part number m70cxr 0300 00 xx xx contact reel for the availability of a u.fl connection and exact part numb er . pacific wireless ( www.pacwireless.com ) supplies a wide range of antennae, including high gai n antennae. although these will require requalification, they may be appropriate for longer range applications. the rootenna is a good solution for ip65 applications. u.fl to sma adaptors / pigtails other antennas can b e used with a pigtail that goes fro m the u.fl connection on the BISM2 to the appropriate ante nna connection, mos t commonly a reverse sma. these are available from a variety of sources; a good range is supplied by: http://jefat ech.com/category/cable_assemblies.ufl high volume quantities can be obtained from hirose. when connectin g to sma antennae, please check whether your antenna is a normal or reverse thread. 12.3 bism1 compatible module (special order) the bism1 compatible forma t version of th e BISM2 bluetooth serial module preserves all of the mechanical mounting detail and dimensions of the earlier module design.
BISM2 bluetooth? hardware integration guide embedded wi reless solutions support center: http://ews - support.lairdtech.com www.lairdtech.com/ bluetooth 29 laird americas: +1 - 800 - 492 - 2320 europe : +44 - 1628 - 858 - 940 hong kong: +852 - 2268 - 6567 x026 this is a special order module for customers who are currently in production with the bism1, but want to migrate to the additional features of the BISM2. it is not recommended for new designs. note : all dimensions are in mm. figure 12 - 1 : top view figure 12 - 2 : side view 12.4 la belling the label contains the p art number and the modules unique bluetooth address. 12.5 ordering information the BISM2 is available with different variants of engineering or production firmware. ordering information is provided below: part number description firmware version trblu23 - 00200 BISM2 with integrated ceramic antenna and standard at firmware version 7.18.0
BISM2 bluetooth? hardware integration guide embedded wi reless solutions support center: http://ews - support.lairdtech.com www.lairdtech.com/ bluetooth 30 laird americas: +1 - 800 - 492 - 2320 europe : +44 - 1628 - 858 - 940 hong kong: +852 - 2268 - 6567 x026 the following parts are available to special order. please contact your laird representative: part number description firmware version trblu23 - 002mp BISM2 with integrated ceramic antenna and standard multipoint firmware version 5.13.es trblu23 - 002hc BISM2 with integrated ceramic antenna and standard hci firmware version 00056 - 01 trblu23 - 00300 BISM2 with u.fl jack and standard at firmware versio n 2.11.0 trblu23 - 003mp BISM2 with u.fl jack and standard multipoint firmware version 5.13.es trblu23 - 003hc BISM2 with u.fl jack and standard hci firmware version 00056 - 01 13 r elated d ocuments the following BISM2 technical documents are also available from the laird BISM2 product page under the documentation tab: ? product brief ? user guide ? at command set user guide ? development kit user guide ? firmware release notes ? at commands quick start guide ? multipoint firmware user guide ? bluetooth core 2.0 specification C www.bluetooth.org the following downloads are also available from the laird rm024 product page: ? laird (ezurio) terminal v6.9.0.zip ? lai rd uwterminal version 6.60.zip ? laird mpbthost v3.5.0.zip 14 d ifferences from p revious m odules the BISM2 is designed to be a drop in replacement for previous bi sm modules from tdk systems and laird . however, some additional features have been made. this section lists all of these changes. more details can be found in the relevant section of the data sheet. ? significant additions have been made to the at command se t. ? pin 27 is now marked as reserved instead of vcc_3v3. it can no longer be relied to provide a 3.3v regulated output. ? pins 33, 35 & 37 are now gpio instead of n/c. the default state is configured as an input. ? pin 39 is now allocated as gpio9 which default s as an input line instead of a vcc_1v8 monitor. this change was made to increase the i/o capability and to prevent noise injecting onto the 1v8 rail. ? the module is physically smaller , so the fixing holes no longer align with those of the previous module . ? a brown - out circuit is now incorporated on the module. reset functionality remains the same. ? the oscillator output is now available.
BISM2 bluetooth? hardware integration guide embedded wi reless solutions support center: http://ews - support.lairdtech.com www.lairdtech.com/ bluetooth 31 laird americas: +1 - 800 - 492 - 2320 europe : +44 - 1628 - 858 - 940 hong kong: +852 - 2268 - 6567 x026 15 d isclaimers laird s bluetooth products are not authorised for use as critical components in life support devices or syste ms without the express written approval of the managing director of laird ltd. the definitions used herein are: a) life support devices or systems are devices which (1) are intended for surgical implant into the body, or (2) support or sustain life and whose failure to perform when properly used in accordance with the instructions for use provided in the labelling can reasonably be expected to result in a significant injury to the user. b) a critical component is any component of a life support device or system w hose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. laird does not assume responsibility for use of any of the circuitry described, no circuit patent licens es are implied and laird reserves the right at any time to change without notice said circuitry and specifications. 15.1 data sheet status laird reserve s the right to change the specification without notice in order to improve the design and supply the best pos sible product. please check with laird for the most recent data before initiating or completing a design. where reference is made to related products from other suppliers, laird takes no responsibility for the information, availability or performance of su ch products. 15.2 warranty laird warrants that its products shall conform to laird s published specifications and remain free from defects in materials and workmanship under normal, proper and intended use for a period of two (2) years from date of purchase, pr ovided that proof of purchase be furnished with any returned equipment. if during the warranty period any component part of the equipment becomes defective by re ason of material or workmanship and laird is immediately notified of such defect, laird shall a t its option supply a replacement part or request return of equipment, freight prepaid, to its designated facility for repair. in the event no trouble is found on products returned for repair, laird reserves the right to charge the customer its standard pu blished repair charge. this warranty shall not apply to any products that have been subject to misuse, bending, twisting, neglect, alteration, improper installation, testing or unauthorized repair performed by anyone other than a laird designated repair fa cility. any non - warranty repairs or maintenance shall be at laird s standard rates in effect at the time. this warranty is in lieu of all other warranties, whether expressed, implied, or statutory, including but not limited to, implied warranties or mercha ntability and fitness for a particular purpose. in no event shall laird be liable, whether in contract, in part, or on any other basis, for any damage sustained by its customers or any other person arising from or related to loss of use, failure or interru ption in the operation of any products, or delay in maintenance, or for incidental, consequential, in direct, or special damages or liabilities, or for loss of revenue, loss of business, or other financial loss arising out of or in connection with the sale, lease, maintenance, use, performance, failure, or interruption of these products.

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